Advancing Chiplet
Interconnectivity
Customizable Standards Based Die-to-Die Interconnect Solutions
Features & Benefits
Customization
Die-to-die solutions are rapidly tailored to your unique needs. Choose your packaging type, data rate, I/O configuration, process and more.
State of the Art PPA
Faster Time to Market
Risk Reduction
Optimized for High Performance Computing, Mobile and AI Markets
- High-bandwidth, low-power, low-latency PHY
- Enables low latency NoC-to-NoC interface between two dies
- 4nm, 5nm, 7nm, 12nm, 16nm process technologies
- Up to 25mm trace lengths, compatible with organic substrates
or advanced packages
Join Our Team
At Blue Cheetah, you will work with some of the world’s most talented engineers and leaders to shape the future of chiplets.
Get in Touch
Our team would love to hear from you. We are always available to answer any questions you should have.