See Blue Cheetah at the DAC 2024 Conference, June 24 to 26, at the Moscone Center in San Francisco.
Visit our Booth #1457 or click to schedule a meeting with us.

Advancing Chiplet
Interconnectivity

Customizable Standards Based Die-to-Die Interconnect Solutions

Open Standards Support

Our BlueLynx die-to-die (D2D) interconnect IP provides physical
(PHY) and link layer chiplet interfaces and supports both Open
Compute Project (OCP) Bunch of Wires (BoW) as well as Universal
Chiplet Interconnect Express (UCIe). BlueLynx connects to on-die
buses/Networks-on-Chip (NoCs) with various standards, including
AMBA® 4 CHI, AXI, ACE, and more.

Features & Benefits

Customization

Die-to-die solutions are rapidly tailored to your unique needs. Choose your packaging type, data rate, I/O configuration, process and more.

State of the Art PPA

Our architects and engineers enable uncompromised design realization.

Faster Time to Market

Our executable generator technology reduces product development and iteration time with implementation-ready results.

Risk Reduction

Compiler like development process produces industry standard design collateral that is predictable and silicon-integration ready.

Optimized for High Performance Computing, Mobile and AI Markets

  • High-bandwidth, low-power, low-latency PHY
  • Enables low latency NoC-to-NoC interface between two dies
  • 4nm, 5nm, 7nm, 12nm, 16nm process technologies
  • Up to 25mm trace lengths, compatible with organic substrates
    or advanced packages

Join Our Team

At Blue Cheetah, you will work with some of the world’s most talented engineers and leaders to shape the future of chiplets.

    Get in Touch

    Our team would love to hear from you. We are always available to answer any questions you should have.