Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation.
Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation.
Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation.
Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation.
Breaking up SoCs into their component parts and putting those and other pieces together in some type of heterogeneous assembly is beginning to take shape, fueled by advances in interconnects, complex partitioning, and industry learnings about what works and what doesn’t.
The widespread adoption of chiplets in domain-specific applications is creating a partitioning challenge that is much more complex than anything chip design teams have dealt with in previous designs.
Nearly all the major systems companies, packaging houses, IDMs, and foundries have focused on chiplets as the best path forward to improve performance and reduce power.
Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja Rao, executive director, business development at Synopsys.
Chiplets have emerged as a critical implementation paradigm for semiconductor products, primarily because they can deliver cost benefits relative to a non-chiplet-based approach.
The first, most well-proven, and obvious benefit of a chiplet-based approach is manufacturing cost.
Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja Rao, executive director, business development at Synopsys.
Vikram Bhatia
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