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Strain, Stress In Advanced Packages Drives New Design Approaches

Top-Down Vs. Bottom-Up Chiplet Design

Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation.

Strain, Stress In Advanced Packages Drives New Design Approaches

Chiplets Make Progress Using Interconnects As Glue

Breaking up SoCs into their component parts and putting those and other pieces together in some type of heterogeneous assembly is beginning to take shape, fueled by advances in interconnects, complex partitioning, and industry learnings about what works and what doesn’t.

Strain, Stress In Advanced Packages Drives New Design Approaches

Partitioning In The Chiplet Era

The widespread adoption of chiplets in domain-specific applications is creating a partitioning challenge that is much more complex than anything chip design teams have dealt with in previous designs.

Nearly all the major systems companies, packaging houses, IDMs, and foundries have focused on chiplets as the best path forward to improve performance and reduce power.

Strain, Stress In Advanced Packages Drives New Design Approaches

Barriers to Chiplet Sockets

Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja Rao, executive director, business development at Synopsys.

Strain, Stress In Advanced Packages Drives New Design Approaches

Enabling Innovative Multi-Vendor Chiplet-Based Designs

Chiplets have emerged as a critical implementation paradigm for semiconductor products, primarily because they can deliver cost benefits relative to a non-chiplet-based approach.
The first, most well-proven, and obvious benefit of a chiplet-based approach is manufacturing cost.  

Strain, Stress In Advanced Packages Drives New Design Approaches

What Comes After HBM For Chiplets

Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja Rao, executive director, business development at Synopsys.

Strain, Stress In Advanced Packages Drives New Design Approaches

Defining The Chiplet Socket

Defining the Chiplet Socket The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it? August 29th, 2024 - By: Brian Bailey...