Defining the Chiplet Socket The industry may have started with the wrong approach for enabling a third-party chiplet ecosystem, but who will step in and fix it? August 29th, 2024 - By: Brian Bailey...
In the News
Blue Cheetah Advancing Chiplet Interconnectivity #61DAC
Blue Cheetah Advancing Chiplet Interconnectivity #61DAC by Daniel Payne on 07-18-2024 at 10:00 am At #61DAC, I love it when an exhibitor booth uses a descriptive tagline to explain what they do,...
Chiplet-Optimized Unified Fabric Interconnect Solution
Chiplet-Optimized Unified Fabric Interconnect Solution Chiplets, the vanguard of semiconductor chip evolution, are revolutionizing the industry by addressing performance and cost. With new standards...
Silicon 100: Startups Worth Watching in 2024
Blue Cheetah was recognized in the EE Times’ 24th revision of the Silicon 100! Each year, EE Times lists 100 promising electronics and semiconductor startups. It examines the relentless march of AI...
When To Expect Domain-Specific AI Chips
When To Expect Domain-Specific AI Chips (title included in top of post similar to ref above) The chip industry is moving toward domain-specific computation, while artificial intelligence (AI) is...
Will Domain-Specific ICs Become Ubiquitous?
How shifts in end markets and device scaling could alter some fundamental assumptions in chip design. Questions are surfacing for all types of design, ranging from small microcontrollers to...
NoCs In 3D Space
Unveil the future with 3D NoC technology: scalable, efficient data communication in advanced chip designs.
2024 Outlook with Elad Alon of Blue Cheetah Analog Design
Elad Alon, Blue Cheetah CEO, discusses the vital role of die-to-die interconnect IP in chiplet integration. With design wins in single-vendor and multi-vendor implementations, Blue Cheetah's...
Chiplet Ecosystems Enable Multi-Vendor Designs
Chiplets dominate semiconductor industry conversations right now – and after the recent Chiplet Summit, we expect the intensity to go up a couple of notches. One company name often heard is Blue...
Die-to-Die Interconnects using Bunch of Wires (BoW)
Chiplets are a popular and trending topic in the semiconductor trade press, and I read about SoC disaggregation at shows like ISSCC, Hot Chips, DAC and others. Once an SoC is disaggregated, the...