SUNNYVALE, Calif., January 21, 2025—Blue Cheetah Analog Design today announced the successful tape-outs of its next generation BlueLynx™ die-to-die (D2D) PHY on Samsung Foundry's SF4X 4nm advanced...
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Micon Global Selected as Sales Representative for Blue Cheetah Analog Design
Micon Global, a trusted technology solutions provider serving global markets, is excited to announce a new strategic sales partnership with Blue Cheetah, a leading innovator in chiplet interconnect...
Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-up of Chiplet-Based Design
SUNNYVALE, Calif., September 3, 2024—Blue Cheetah Analog Design and LG Electronics Inc. (LG) announced that they are collaborating and have demonstrated silicon success for a new generation of...
Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
Baya Systems and Blue Cheetah Analog Design today announced the availability of a combined chiplet-optimized Network on Chip (NOC).
Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP for Its AI and RISC-V solutions
Tenstorrent partners with Blue Cheetah for advanced die-to-die interconnect IP, boosting AI and RISC-V chiplet solutions.
Blue Cheetah Demonstrates Industry-Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets
Blue Cheetah Analog Design, the leader in rapidly customized die-to-die (D2D) interconnect IP solutions for chiplets, announced its latest successful silicon bring-up of its advanced 2-16 Gbps BlueLynx D2D interconnect IP in a 12nm test chip.
Media Alert: Blue Cheetah CEO Elad Alon to Present at Linley Fall Processor Conference
SUNNYVALE, Calif., October 18, 2022—Blue Cheetah Analog Design Inc. announced today that Elad Alon, CEO, and Cofounder of Blue Cheetah, will present at Linley Fall Processor Conference, which will...