Die-to-Die Interconnects using Bunch of Wires (BoW)

Sep 21, 2022 | In the News

Chiplets are a popular and trending topic in the semiconductor trade press, and I read about  SoC disaggregation at shows like ISSCCHot ChipsDAC and others. Once an SoC is disaggregated, the next challenge is deciding on the die-to-die interconnect approach. The Open Compute Project (OCP) started 10 years ago as a way to share designs of data center products between a diverse set of companies, like: ARM, Meta, IBM, Intel, Google, Microsoft, Dell, NVIDIA, HP Enterprise, Lenovo and others. In July the OCP Foundation announced their approach to SoC disaggregation with an interface specification, and dubbed it Bunch of Wires (BoW)…