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Strain, Stress In Advanced Packages Drives New Design Approaches

Dec 19, 2024 | In the News

 

Strain, Stress In Advanced Packages Drives New Design Approaches

Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial architectural planning stage; new tools may be needed.

December 19th, 2024 – By: Ann Mutschler

 

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, dependencies, and interactions, and driving demand for new tools.
Read more at SemiConductor Engineering
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