Chiplets Make Progress Using Interconnects As Glue
Industry learning expands as more SoCs are disaggregated at leading edge, opening door to more third-party chiplets.
Breaking up SoCs into their component parts and putting those and other pieces together in some type of heterogeneous assembly is beginning to take shape, fueled by advances in interconnects, complex partitioning, and industry learnings about what works and what doesn’t.
