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Top-Down Vs. Bottom-Up Chiplet Design

Nov 27, 2024 | In the News

 

Top-Down Vs. Bottom-Up Chiplet Design

Third-party chiplets are hitting the market as chiplet models evolve. Who’s calling the shots isn’t clear yet.

November 26th, 2024 – By: Ann Mutschler

 

Chiplets are gaining widespread attention across the semiconductor industry, but for this approach to really take off commercially it will require more standards, better modeling technologies and methodologies, and a hefty amount of investment and experimentation.

 

Read more at SemiConductor Engineering
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