When To Expect Domain-Specific AI Chips (title included in top of post similar to ref above) The chip industry is moving toward domain-specific computation, while artificial intelligence (AI) is...
In the News
Will Domain-Specific ICs Become Ubiquitous?
How shifts in end markets and device scaling could alter some fundamental assumptions in chip design. Questions are surfacing for all types of design, ranging from small microcontrollers to...
NoCs In 3D Space
Unveil the future with 3D NoC technology: scalable, efficient data communication in advanced chip designs.
2024 Outlook with Elad Alon of Blue Cheetah Analog Design
Elad Alon, Blue Cheetah CEO, discusses the vital role of die-to-die interconnect IP in chiplet integration. With design wins in single-vendor and multi-vendor implementations, Blue Cheetah's...
Chiplet Ecosystems Enable Multi-Vendor Designs
Chiplets dominate semiconductor industry conversations right now – and after the recent Chiplet Summit, we expect the intensity to go up a couple of notches. One company name often heard is Blue...
Die-to-Die Interconnects using Bunch of Wires (BoW)
Chiplets are a popular and trending topic in the semiconductor trade press, and I read about SoC disaggregation at shows like ISSCC, Hot Chips, DAC and others. Once an SoC is disaggregated, the...
Analog Design Acceleration for Chiplet Interface IP
Compared to the automation of digital design, the development of automation for analog has taken a much more arduous path. Over the decades there have been many projects both academic and commercial...
Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead
By leveraging proprietary generator technology, Blue Cheetah quickly enables customers with BoW PHY solutions with best-in-class power, performance, and area. Blue Cheetah, a leading provider of...
Momentum Builds For Advanced Packaging
The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs. Foundries, OSATs and others are rolling...